<?xml version="1.0" encoding="UTF-8"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-10-23T13:47:32Z</responseDate><request verb="GetRecord" identifier="oai:gumushane-rdlopen.rawdatalibrary.net:gumushane/13819" metadataPrefix="oai_dc">https://gumushane-rdlopen.rawdatalibrary.net/oai/request</request><GetRecord><record><header><identifier>oai:gumushane-rdlopen.rawdatalibrary.net:gumushane/13819</identifier><datestamp>2026-10-22T11:36:35Z</datestamp><setSpec>openaire</setSpec><setSpec>driver</setSpec><setSpec>com_gumushane_10000</setSpec><setSpec>col_gumushane_10001</setSpec><setSpec>com_gumushane_10010</setSpec><setSpec>col_gumushane_10179</setSpec></header><metadata><oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><dc:title>Thermal Energy Storage Performance of EPCM-Impregnated Moss Biomass Placed in OKAL Chipboard for Use in Building Envelopes and Interior Space Separation</dc:title><dc:creator>Can, Ahmet</dc:creator><dc:creator>Erata, Hüseyin</dc:creator><dc:creator>Gencel, Osman</dc:creator><dc:creator>Erol, Tuğçenur Bayraktar</dc:creator><dc:creator>Sarı, Ahmet</dc:creator><dc:creator>Batan, Nevzat</dc:creator><dc:subject>building elements</dc:subject><dc:subject>energy-efficient</dc:subject><dc:subject>eutectic phase change material</dc:subject><dc:subject>moss biomass</dc:subject><dc:subject>OKAL chipboard</dc:subject><dc:description>This study develops an innovative thermal energy storage approach for lightweight building systems by using eutectic phase change material (EPCM)-impregnated moss biomass (Cp/EPCM) in the internal voids of OKAL chipboard (OKS-Cp/EPCM). A high latent heat storage (LHS) capacity of 121.4 J/g was achieved with a 72% EPCM loading. Furthermore, the thermal conductivity of the OKS-Cp/EPCM decreased from 0.15074 W/m·K to 0.109 W/m·K. Thermal imaging results showed that the OKS-Cp/EPCM improved thermal comfort by reducing the surface temperature by approximately 10.5 °C in hot environments and providing an approximately 1 °C higher surface temperature in cold environments. However, TGA analyses revealed that the thermal resistance of the composite was limited. Relative humidity results also indicated that Cp/EPCM positively contributed to the moisture regulation performance of the board. Based on these results, OKS-Cp/EPCM offers a promising solution for the development of energy-efficient and thermally comfortable lightweight building elements.</dc:description><dc:publisher>Multidisciplinary Digital Publishing Institute (MDPI)</dc:publisher><dc:date>2026</dc:date><dc:type>Article</dc:type><dc:identifier>https://rdlopen.rawdatalibrary.net/r/gumushane/13819</dc:identifier><dc:identifier>https://doi.org/10.3390/buildings16153102</dc:identifier><dc:identifier>2075-5309</dc:identifier><dc:language>en</dc:language><dc:relation>Buildings</dc:relation><dc:rights>info:eu-repo/semantics/openAccess</dc:rights><dc:type>info:eu-repo/semantics/article</dc:type><dc:identifier>https://gumushane-rdlopen.rawdatalibrary.net/tr/items/gumushane/13819</dc:identifier></oai_dc:dc></metadata></record></GetRecord></OAI-PMH>